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rf & protection devices data sheet revision 3.2, 2016-01-20 final BGT24AT2 silicon germanium 24 ghz transmitter mmic
edition 2016-01-20 published by infineon technologies ag 81726 munich, germany ? 2016 infineon technologies ag all rights reserved. legal disclaimer the information given in this docu ment shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infine on technologies hereby disclaims any and all warranties and liabilities of any kind, including witho ut limitation, warranties of non-infrin gement of intellectua l property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies compon ents may be used in life-su pport devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safe ty or effectiveness of that de vice or system. life support devices or systems are intended to be implanted in the hu man body or to support an d/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
BGT24AT2 silicon germanium 24 ghz transmitter mmic final data sheet 3 revision 3.2, 2016-01-20 trademarks of infineon technologies ag aurix?, bluemoon?, c166?, ca npak?, cipos?, cipurse?, comn eon?, econopack?, coolmos?, coolset?, corecontrol?, crossave?, dave?, easypim?, econobri dge?, econodual?, econopim?, eicedriver?, eupec?, fcos?, hitfe t?, hybridpack?, i2rf?, isoface?, isopack?, mipaq?, modstack?, my-d?, novalithic?, omnitune?, optimos?, origa?, primarion?, primepack?, primestack?, pr o-sil?, profet?, rasic?, re versave?, satric?, sieget?, sindrion?, sipmos?, smarti?, smartlew is?, solid flash?, tempfet?, thinq!?, trenchstop?, tricore?, x-go ld?, x-pmu?, xmm?, xposys?. other trademarks advance design system? (ads) of agilent te chnologies, amba?, arm?, multi-ice?, keil?, primecell?, realview?, thumb?, vision? of arm limited, uk. autosar? is licensed by autosar development partnership. bluetooth? of bluetooth sig inc. cat-iq? of dect forum. colossus?, firstgps? of trimble navigation ltd. emv? of emvc o, llc (visa holdings in c.). epcos? of epcos ag. flexgo? of microsoft corp oration. flexray? is licensed by flexray consortium. hyperterminal? of hilgraeve incorporated. iec? of commission electrot echnique internationale. irda? of infrared data association corporation. iso? of international organization for standardization. matlab? of mathworks, inc. maxim? of maxim integrated products, inc. microtec?, nucleus? of mentor graphics corporation. mifare? of nx p. mipi? of mipi alliance, inc. mips? of mips technologies, inc., usa. murata? of murata manufacturing co., microwave offi ce? (mwo) of applied wave research inc., omnivision? of omnivision technologies, inc. open wave? openwave systems inc. red hat? red hat, inc. rfmd? rf micro devices, inc. sirius? of sirius sate llite radio inc. solaris? of sun microsystems, inc. spansion? of spansion llc ltd. symbian? of sy mbian software limited. taiyo yuden? of taiyo yuden co. teaklite? of ceva, inc. t ektronix? of tektroni x inc. toko? of toko kabushiki kaisha ta. unix? of x/open company limited. verilog?, palladium? of cadence design systems, inc. vlynq? of texas instruments inco rporated. vxworks?, wind river? of wind river systems, inc. zetex? of diodes zetex limited. last trademarks update 2010-10-26 BGT24AT2 silicon germanium 24 ghz transmitter mmic revision history: 2016-01-20, revision 3.2 previous revision: 20 15-04-27 revision 3.1 page subjects (major cha nges since last revision)
BGT24AT2 silicon germanium 24 ghz transmitter mmic table of contents final data sheet 4 revision 3.2, 2016-01-20 table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 list of figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 list of tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.2 esd integrity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.3 power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.4 vco . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.5 frequency divider . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2.6 tx and lo pga . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.7 temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.8 output level detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2.9 sensor multiplexer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4 spi . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5 sensor multiplexer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 6 lo logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 7 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 table of contents
BGT24AT2 silicon germanium 24 ghz transmitter mmic list of figures final data sheet 5 revision 3.2, 2016-01-20 figure 1 BGT24AT2 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 figure 2 block diagram frequency div ider . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 3 timing diagram of the spi . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 figure 4 package outline (top, side and bo ttom view) of vqfn32-9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 figure 5 marking layout vqfn32-9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 figure 6 tape of vqfn32-9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 list of figures
BGT24AT2 silicon germanium 24 ghz transmitter mmic list of tables final data sheet 6 revision 3.2, 2016-01-20 table 1 absolute maximum ratings, t a = -40 c to 125 c; all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) 9 table 2 esd integrity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 3 electrical characteristics, t a = -40 c ... 125 c, positve current flowing into pin (unless otherwise specified). 11 table 4 electrical characteristics, , v cc = 3.135 v to 3.465 v, t a = -40 c to 125 c, pga output power = p max , all voltages with respect to ground, positive cu rrent flowing into pin (unless otherwise specified), parameters specified in the frequency range from 24 ghz to 24.25 ghz including matching structures and a package footprint provided by infineon using the high frequency laminate rogers 4350b (see application note an359) 11 table 5 frequency divider truth table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 table 6 electrical characteristics, v cc = 3.135 v to 3.465 v, t a = -40 c to 125 c, vco frequency = 24.0 to 24.25 ghz, di vider division ratio = 1024, all voltages with respect to ground (unless otherwise specified). 13 table 7 electrical characteristics, v cc = 3 .135 v to 3.465 v, t a = -40 c to 125 c, pga output power = p max , positive current flowing into pin (unless othe rwise specified), parame ters specified in the frequency range from 24 ghz to 24.25 ghz include matching structures and a package footprint provided by infineon using the high frequency lami nate rogers 4350b (see application note an359). reference board losses and 2.92 mm connector loss deembedded to outer trafo edge (reference plane). 14 table 8 electrical characteristics, v cc =3.3v, t a = -40 c to 125 , application and mmic external circuit acc. to application note an359, all voltages with respect to grou nd (unless otherwise specified). 15 table 9 electrical characteristics, v cc = 3.135 v to 3.465 v, t a = -40 c to 125 c, application and mmic external circuit acc. to application note an359, a ll voltages with respect to ground (unless otherwise specified) 16 table 10 electrical characteristics, v cc = 3.135 v to 3.465 v, t a = -40 c to 125 c, application and mmic external circuit acc. to application note an359, a ll voltages with respect to ground (unless otherwise specified) 16 table 11 pin definition and function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 table 12 i/o internal circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 table 13 spi data bit description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 table 14 spi interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 table 15 specification for spi pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 table 16 truth table amux . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 table 17 truth table lo logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 list of tables
product name package chip marking BGT24AT2 vqfn32-9 t1824 BGT24AT2 silicon germanium 24 ghz transmitter mmic BGT24AT2 final data sheet 7 revision 3.2, 2016-01-20 1 features ? 24 ghz signal source with 2 transm itter outputs and 1 local oscillator output ? external / internal phase inversion and rf pulsing capability ? programmable gain amplifiers (pga) with 6 bit resolution ? fully integrated low phase noise vco ? frequency divider with 23.5 mhz output ? on chip rf output level and temperature sensors ? multiplexed output of analog sensor signals ? single ended rf terminals ? single supply voltage 3.3 v ? low power consumption 775 mw typ. ? 200 ghz bipolar sige:c technology b7hf200 ? fully esd protected device ? vqfn-32-9 leadless plastic package incl uding lead-tip-inspection (lti) feature ? pb-free (rohs compliant) package ? aec q100 qualified description the BGT24AT2 is a low phase noise 24 ghz ism band mult ifunction signal source, manufactured in a monolithic silicon germanium semicond uctor process technology. it accommodates a 24 ghz fundamental voltage controlled oscillato r and a frequency divider with a division ratio of 1024. the frequency divider output is differential. the three individual rf outputs generate a typical outp ut power of +10 dbm, adjustable via spi-programmable 6 bit dac?s. fast pulsing and phase inversion of the transmit signal is provided either using dedicated control inputs or the 64 bit spi. automatic configuration of the lo-output is possible using a dedicated logic. rf output level sensors as well as a temperature sens or are implemented for monitoring purposes. the analog sensor signals along with an additi onal optional analog input are multiplexed to one common output. the mmic is manufactured in a 200 ghz, 0.18 m sige:c technology and is packaged in a 32 pin leadless rohs compliant vqfn package with lti feature.
BGT24AT2 silicon germanium 24 ghz transmitter mmic features final data sheet 8 revision 3.2, 2016-01-20 figure 1 BGT24AT2 block diagram block diagram bgt 24 at2.vsd spi 64 bit temp. sensor amux 0/180 balun 0/180 balun balun f-div /1024 0/180 dac 6bit dac 6bit dac 6bit dac 6bit div divx div_dis_out ph_l o lo_on tx2 ph_ tx1 tx1_on tx1 ana_in vtune_f vtune _c spi _di spi _clk spi _en spi _do vcc vee lo logic vcc_vco vee _ vco buf1 buf2 pga tx1 pga tx2 pga lo ana_ out lo ph_ tx2 tx2_on
BGT24AT2 silicon germanium 24 ghz transmitter mmic electrical characteristics final data sheet 9 revision 3.2, 2016-01-20 2 electrical characteristics 2.1 absolute maximum ratings attention: stresses exceeding the maximum values listed here may cause permanent damage to the device. exposure to absolute maximum rating conditions for extended periods of time may affect device reliability. maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. attention: integrated protection functions are designed to prevent ic destruction under fault conditions as described in the data sheet. fault conditions are considered as ?outside? normal operating range. protection functions are not designed for continuous repetitive operation. attention: test means that the parameter is not subject to production test. it was verified by design / characterization. note: no permanent damage of the device is possible due to an undefined spi state table 1 absolute maximum ratings, t a = -40 c to 125 c; all voltages with respect to ground, positive current flowing into pin ( unless otherwise specified) parameter symbol values unit test note / test condition min. typ. max. supply voltage v cc -0.3 ? v cc +0.3 v ? voltage applied to none-rf pins 1) 1) for spi_en, spi_di, spi_clk the applied voltage may exceed giv en ratings als long as current into these pins is limited to i spi =1ma v io -0.3 ? v cc +0.3 v ? dc voltage at rf pins vdc rf ??0v mmic provides short circuit to gnd for tx1, tx2 and lo pins dc voltage at pins vtune_f, vtune_c v tune -0.3 ? v cc +0.3 v ? dc voltage at pins div, divx v divider 2? v cc +0.3 v ? total power dissipation p diss ? ? 1000 mw ? junction temperature t j -40 ? 170 c ? ambient temperature range t a -40 ? 125 c t a = temperature at package soldering point storage temperature range t stg -50 ? 125 c ?
BGT24AT2 silicon germanium 24 ghz transmitter mmic electrical characteristics final data sheet 10 revision 3.2, 2016-01-20 2.2 esd integrity attention: test means that the parameter is not subject to production test. it was verified by design / characterization. table 2 esd integrity parameter symbol values unit test note / test condition min. typ. max. esd robustness hbm 1) 1) according to ansi/esda/jedec js-001 (r = 1.5kohm, c = 100 pf) for electrostatic dischar ge sensitivity testing, human body model (hbm)-component level v esd-hbm -1?1kv all pins esd robustness, cdm 2) 2) according to jedec jesd22-c101 field-induced charged devi ce model (cdm), test method for electrostatic-discharge withstand thresholds of microelectronic components please note that this result is subject to: - lot variations within the manufacturing process as specified by infineon - changes in the specific test setup v esd-cdm -500 ? 500 v all pins -750 ? 750 package corner pins
BGT24AT2 silicon germanium 24 ghz transmitter mmic electrical characteristics final data sheet 11 revision 3.2, 2016-01-20 2.3 power supply 2.4 vco table 3 electrical characteristics, t a = -40 c ... 125 c, positve current flowing into pin (unless otherwise specified) . parameter symbol values unit test note / test condition min. typ. max. supply voltage v cc 3.135 3.3 3.465 v ? supply current nominal operation mode i cc,on ? 235 280 ma nom. operation mode, spi-state: 9f7f 2903 9f7c 10ff hex supply current standby mode i cc,stdby ? 6585ma all functional blocks disabled, spi-state: 0000 0000 0000 0000 hex table 4 electrical characteristics, , v cc = 3.135 v to 3.465 v, t a = -40 c to 125 c, pga output power = p max , all voltages with respect to ground, positive cu rrent flowing into pin (unless otherwise specified), parameters specified in the frequency range from 24 ghz to 24.25 ghz including matching structures and a package footprint provided by infineon using the high frequency laminate rogers 4350b (see application note an359) parameter symbol values unit test note / test condition min. typ. max. vco frequency range f vco 24.0 24.125 24.25 ghz ? 1)2) vco tuning voltage for vco frequency range v tune_f 0.1 ? 0.9 v ? number of usable vco coarse tune dac states n 2??? vtune_f applied via series resistor 1k vco phase noise @ 1 khz p n,p 1khz ?-30-18dbc/hz ? vco phase noise @ 10 khz p n,p 10khz ?-59-50dbc/hz ? vco phase noise @ 100 khz p n,p 100khz ?-82-76.4dbc/hz ? vco phase noise @ 1 mhz p n,p 1mhz ? -103 -97.4 dbc/hz ? vco phase noise @ 10 mhz p n,p 10mhz ? -123 -117.4 dbc/hz ? vco amplitude noise @ 10 khz p n,a 10khz ??-125dbc/hz measured at +4 dbm output power vco amplitude noise @ 100 khz p n,a 100khz ??-135dbc/hz measured at +4 dbm output power
BGT24AT2 silicon germanium 24 ghz transmitter mmic electrical characteristics final data sheet 12 revision 3.2, 2016-01-20 attention: test means that the parameter is not subject to production test. it was verified by design / characterization. vco amplitude noise @ 1 mhz p n,a 1mhz ? -150 -145 dbc/hz measured at +4 dbm output power vtune_f input resistance r vtune_f 100??k nonlinear, see leakage current specification leakage current at pin vtune_f i vtune_f -40 ? ? a at min. tuning voltage vtune_f input capacitance c vtune_f ??10pf ? vtune_c input resistance r vtune_c 1440 1800 2160 ? vtune_c dac current for pga state 63 i vtune_c, dac 1.2??ma ? static pulling f vco change vs. load f sp -1 ? +1 mhz at all tx ports, 10 db mismatch, all phases dynamic pulling phase and tx switch change f dp1 -1 ? +1 mhz at all tx ports, 10 db mismatch, all phases dynamic pulling tx1 to tx2 switch change f dp2 -1 ? +1 mhz at all tx ports, 10 db mismatch, all phases vco pushing f/ v cc -20 -60 ? ? +20 +60 mhz/v v cc 3.2 v, t a -20 c 3) 3) spurious level harmonics a harm ??-32dbc at max. output power; h2 measured at swm connector 3) spurious level non harmonics a nharm ??-48dbm ? vco tuning speed f/ t 70??mhz/ s ? vco tuning sensitivity f/ v tune_f ??2800 2200 mhz/v differential sensitivity lin. between f 1 24.05 ghz and f 2 = 24.14 ghz vco frequency drift 4) f drift ? 10 ? khz ? 1) proper adjustment of v tune_c required to cover frequency band with specified v tune_f 2) montonic increasing frequency vs. vtune_f 3) dynamic measurement: vtune_f = 0.1 v, pga state = 63, f = 10 khz, a = 50 mvpp, dynamic v cc must stay within specified limits 4) within 50ms and under following conditions: - ambient temperature - stable - supply voltage - stable - rf ports at least 50 s after on/off or off/on and phase transitions - divider in on/off at least 50 s after off/on transitions table 4 electrical characteristics, (cont?d), v cc = 3.135 v to 3.465 v, t a = -40 c to 125 c, pga output power = p max , all voltages with respect to ground, positive current flowing into pin (unless otherwise specified), parameters specified in the frequ ency range from 24 ghz to 24.25 ghz including matching structures and a package footprint provided by infineon us ing the high frequency laminate rogers 4350b (see application note an359) parameter symbol values unit test note / test condition min. typ. max.
BGT24AT2 silicon germanium 24 ghz transmitter mmic electrical characteristics final data sheet 13 revision 3.2, 2016-01-20 2.5 frequency divider the block diagram of the frequency divider is shown in figure 2 , a compatible truth table is given in table 5 figure 2 block diagram frequency divider table 5 frequency divider truth table 1)2) 1) deviating states not allow ed, undefined divider output 2) modes /16 and /256 for information only! en_div sel_div sel_divbuf dis_divout mode 1x1 x /16 1100/256 1 0 0 0 /1024 1 x 0 1 output disabled 0 x x x shutdown table 6 electrical characteristics, v cc = 3.135 v to 3.465 v, t a = -40 c to 125 c, vco frequency = 24.0 to 24.25 ghz, di vider division ratio = 1024, all voltages with respect to ground (unless otherwise specified). parameter symbol values unit test note / test condition min. typ. max. dividing factor d div ? 256 1024 ?? ? divider output impedance z out 240 300 360 into mmic 1) output voltage v div,1024 900 1150 1400 mvpp into 300 load 2) en_div /1 6 buffer sel_div dis_divout *) sel_divbuf in div /1 6 div_dis_out BGT24AT2_freq_div_16_256_1024.vsd *) constant power dissipation in both states /16 /4 mux /256 /1024 divx
BGT24AT2 silicon germanium 24 ghz transmitter mmic electrical characteristics final data sheet 14 revision 3.2, 2016-01-20 attention: test means that the parameter is not subject to production test. it was verified by design / characterization. 2.6 tx and lo pga common mode output voltage v div,cm,en 2.35 2.75 3.15 v output enabled 2) v divx,cm,en 2.35 2.75 3.15 output enabled 2) v div,cm,dis ? v cc ? output enabled 2) v divx,cm,dis 1.6 2.15 2.60 output enabled 2) v div,cm,off ? v cc ? shutdown 2) v divx,cm,off ? v cc ? shutdown 2) duty cycle dc ?0.5?? ? 1) divider output stable for vswr < 20:1 2) measured using t-pad-attenuator on reference pcb as provided by infineon (see application note an359) table 7 electrical characteristics, v cc = 3 .135 v to 3.465 v, t a = -40 c to 125 c, pga output power = p max , positive current flowing into pin (unless othe rwise specified), parame ters specified in the frequency range from 24 ghz to 24.25 ghz include matching structures and a package footprint provided by infineon using the high frequency lami nate rogers 4350b (see application note an359). reference board losses and 2.92 mm connector loss deembedded to outer trafo edge (reference plane). parameter symbol values unit test note / test condition min. typ. max. output power pga min p min ??-26dbm ? output power pga max p max 71013dbm ? pga coarse resolution interval r c ?? 8 db/bit p out -26 dbm pga mid resolution interval r m ??3db/bit p out -13 dbm pga fine resolution interval r f ? ? 0.6 db/bit p out +1 dbm output power variation in temp. range p txtemp -1.25 ? 0.75 db ? output match s 22 ? ? ? ? ? ? -8 -5.5 0 db v cc =3.3 v, t a =25c 1) pga state 47 pga state 23 pga state 0 output impedance z tx ?50? single ended tx on/off isolation i txon/off 30 ? ? db p out -1 dbm tx1/tx2 isolation i tx1/tx2 30 ? ? db p out -1 dbm tx on/off switching time t on/off ??2ns ? table 6 electrical characteristics, (cont?d) v cc = 3.135 v to 3.465 v, t a = -40 c to 125 c, vco frequency = 24.0 to 24.25 ghz, di vider division ratio = 1024, all voltages with respect to ground (unless otherwise specified). parameter symbol values unit test note / test condition min. typ. max.
BGT24AT2 silicon germanium 24 ghz transmitter mmic electrical characteristics final data sheet 15 revision 3.2, 2016-01-20 attention: test means that the parameter is not subject to production test. it was verified by design / characterization. 2.7 temperature sensor attention: test means that the parameter is not subject to production test. it was verified by design / characterization. phase shifter phase imbalance p 175 180 185 deg ? phase shifter amplitude imbalance a -0.5 0 0.5 db ? phase shifter switching time t phase ??100ns ? following parameter for pins: ph_tx1, ph _lo, ph_tx2, tx1_on, lo_on, tx2_on high-level input voltage v i_high 2.0 ? ? v ? low-level input voltage v i_low ??0.8v ? input capacitance c in ??2pf ? pull up resitor rpl 27.2 34 40.8 k t a =25c leakage current into pins i leakage -100 ? 75 a ? 1) solt calibration, reference plane at swm connector table 8 electrical characteristics, v cc =3.3v, t a = -40 c to 125 , application and mmic external circuit acc. to application note an359, all voltages with respect to gr ound (unless otherwise specified) . parameter symbol values unit test note / test condition min. typ. max. temperature sensor operating range t tsens -40 ? 125 c ? output voltage v tsense25 1.4 1.5 1.6 v at t si = 25c sensitivity s tsens 4.3 4.7 5.1 mv/k ? setup time t tsens ??20 s c load 2.2 nf and r load 10 k at ana_out power supply rejection ratio psrr 16 24 ? db measured at t si = 25c and v cc,min / v cc,max table 7 electrical characteristics, (cont?d) v cc = 3 .135 v to 3.465 v, t a = -40 c to 125 c, pga output power = p max , positive current flowing into pin (unless otherwise specified), parameters specified in the frequency range from 24 ghz to 24.25 ghz incl ude matching structures and a package footprint provided by infineon using the high frequency lami nate rogers 4350b (see application note an359). reference board losses and 2.92 mm connector loss deembedded to outer trafo edge (reference plane). parameter symbol values unit test note / test condition min. typ. max.
BGT24AT2 silicon germanium 24 ghz transmitter mmic electrical characteristics final data sheet 16 revision 3.2, 2016-01-20 2.8 output level detector attention: test means that the parameter is not subject to production test. it was verified by design / characterization. 2.9 sensor multiplexer attention: test means that the parameter is not subject to production test. it was verified by design / characterization. table 9 electrical characteristics, v cc = 3.135 v to 3.465 v, t a = -40 c to 125 c, application and mmic external circuit acc. to application note an359, a ll voltages with respect to ground (unless otherwise specified) parameter symbol values unit test note / test condition min. typ. max. output voltage v out 1.17 ? 1.29 v pga state = 0, all channels rf off detector tx1 and tx2 absolute error e tx1, tx2 -2 ? +2 db at p out > -1 dbm, calculation based on equation in app. note an359 detector lo absolute error e lo -2 ? +2 db at p out > -1 dbm, calculation based on equation in app. note an359 setup time t lsens ??20 s c load 2.2 nf and r load 10 k at ana_out table 10 electrical characteristics, v cc = 3.135 v to 3.465 v, t a = -40 c to 125 c, application and mmic external circuit acc. to application note an359, a ll voltages with respect to ground (unless otherwise specified) parameter symbol values unit test note / test condition min. typ. max. input voltage range v in 1?2v ? input current i in ??1 a ? output impedance r out ?2040 ? offset voltage v offset -10 ? 10 mv at 10 k load resistance
BGT24AT2 silicon germanium 24 ghz transmitter mmic pin description final data sheet 17 revision 3.2, 2016-01-20 3 pin description table 11 pin definition and function pin no. name function 1 ph_tx1 tx1 phase 2 tx1_on tx1 enable 3 lo_on lo enable 4 vee ground 5 lo lo rf output signal 6 vee ground 7 vee ground 8 ph_lo lo phase 9 tx2_on tx2 enable 10 ph_tx2 tx2 phase 11 vee ground 12 tx2 tx2 rf output signal 13 vee ground 14 vcc supply voltage 15 div_dis_out divider disable output 16 spi_do spi data output 17 divx divider output negative port 18 div divider output positive port 19 ana_in analog signal input 20 vcc_vco supply voltage vco 21 vee ground 22 vtune_f vco tuning voltage (fine) 23 vtune_c vco tuning voltage (coarse) 24 vee_vco ground vco 25 vcc supply voltage 26 spi_en spi enable 27 spi_clk spi clock 28 spi_di spi data input 29 ana_out analog output signal 30 vee ground 31 tx1 tx1 rf output signal 32 vee ground
BGT24AT2 silicon germanium 24 ghz transmitter mmic pin description final data sheet 18 revision 3.2, 2016-01-20 table 12 i/o internal circuits pin no. name i/o internal circuits 5, 12, 31 lo, tx2, tx1 1, 2, 3, 8, 9, 10 ph_tx1, tx1_on, lo_on, ph_lo, tx2_on, ph_tx2 28 spi_di 26, 27 spi_en, spi_clk lo, tx2, tx1 vee ph_tx1, tx1_on, lo_on vee vcc 34k ? 10k ? ph_lo, tx 2_on, ph_tx2 spi_di vee vcc 4k ? 94k ? ? 23,5k ?
BGT24AT2 silicon germanium 24 ghz transmitter mmic pin description final data sheet 19 revision 3.2, 2016-01-20 29 ana_out 15 div_dis_out 16 spi_do 17, 18 divx, div table 12 i/o internal circuits pin no. name i/o internal circuits ana_out vee vcc 20 ? div_dis_out vee vcc 25k ? 100 ? spi_do vee vcc 80 ? 80 ? div, divx vee vcc 300 ?
BGT24AT2 silicon germanium 24 ghz transmitter mmic pin description final data sheet 20 revision 3.2, 2016-01-20 19 ana_in 22, 24 vtune_f,vee_vco 23, 24 vtune_c, vee_vco 4, 6, 7, 11, 13, 14, 20, 21, 24, 25, 30, 32 vee, vcc, vcc_vco, vee_vco, table 12 i/o internal circuits pin no. name i/o internal circuits ana_in vee vcc 800 ? vtune_f vee_vco 50 ? 5pf vtune_c 50 ? 5pf 1,8k ? vee_vco vee_vco vcc_vco vee vcc
BGT24AT2 silicon germanium 24 ghz transmitter mmic spi final data sheet 21 revision 3.2, 2016-01-20 4spi communication to the transceiver is done via a serial-per ipheral-interface (spi). the 64 bit spi has a hardwired power-on reset, whic h sets the output bits to a defined state after turning on the supply voltage. data transmission is started by a negativ e edge on spi_en. data at spi _di is then read at the fa lling edge of spi_clk. the most significant bit (msb) is read first. table 13 spi data bit description data bit name description (logic high) power on reset state 0 (lsb) tx1_a5 msb of tx1 pga dac output power control 0 1 tx1_a4 tx1 pga dac output power control 0 2 tx1_a3 tx1 pga dac output power control 0 3 tx1_a2 tx1 pga dac output power control 0 4 tx1_a1 tx1 pga dac output power control 0 5 tx1_a0 lsb of tx1 pga dac output power control 0 6 tx1_en_dac tx1 pga dac enable 0 7 lo_en_dac lo pga dac enable 0 8n.c. 0 9n.c. 0 10 n.c. 0 11 n.c. 0 12 en_buf1 buffer amplifier buf1 enable 0 13 n.c. 0 14 n.c. 0 15 n.c. 0 16 vco_a5 msb of coarse tune dac 0 17 vco_a4 vco coarse tune dac 0 18 vco_a3 vco coarse tune dac 0 19 vco_a2 vco coarse tune dac 0 20 vco_a1 vco coarse tune dac 0 21 vco_a0 lsb of vc o coarse tune dac 0 22 en_dac_vco vco coarse tune dac enable 0 23 ph1_spi_on phase control tx1 via spi 0 24 tx1_sel1 tx1 control bit (?0?=via ext. pulse pin, ?1?= via spi) 0 25 tx1_spi_on tx1 enable via spi 0 26 lo_spi_on lo enable via spi 0 27 amux2_sel0 amux2 control bit 0 28 amux2_sel1 amux2 control bit 0 29 amux2_sel2 amux2 control bit 0 30 lo_sel1 lo logic control bit 0
BGT24AT2 silicon germanium 24 ghz transmitter mmic spi final data sheet 22 revision 3.2, 2016-01-20 31 en_buf2 buffer amplifier buf2 enable 0 32 en_div frequency divider enable 0 33 en_vco vco enable 0 34 amux1_sel0 amux1 control bit 0 35 amux1_sel1 amux1 control bit 0 36 n.c. 0 37 phlo_spi_on phase control lo via spi 0 38 ph2_spi_on phase control tx2 via spi 0 39 ph_sel1 phase control bit (?0?=via ext. pulse pin, ?1?=via spi) 0 40 tx2_sel1 tx2 control bit (?0?=via ext. pulse pin, ?1?=via spi) 0 41 tx2_spi_on tx2 enable via spi 0 42 amux3_sel1 amux3 control bit 0 43 amux3_sel0 amux3 control bit 0 44 n.c. 0 45 lo_sel0 lo control bit 0 46 n.c. 0 47 n.c 0 48 tx2_a5 msb of tx2 pga dac output power control 0 49 tx2_a4 tx2 pga dac output power control 0 50 tx2_a3 tx2 pga dac output power control 0 51 tx2_a2 tx2 pga dac output power control 0 52 tx2_a1 tx2 pga dac output power control 0 53 tx2_a0 lsb of tx2 pga dac output power control 0 54 tx2_en_dac tx2 pga dac enable 0 55 lo_a5 msb of lo pg a dac output power control 0 56 lo_a4 lo pga dac output power control 0 57 lo_a3 lo pga dac output power control 0 58 lo_a2 lo pga dac output power control 0 59 lo_a1 lo pga dac output power control 0 60 lo_a0 lsb of lo pga dac output power control 0 61 sel_divbuf frequency divider control bit 0 62 sel_div frequency divider control bit 0 63 (msb) dis_divout frequenc y divider output disable 0 table 13 spi data bit description (cont?d) data bit name description (logic high) power on reset state
BGT24AT2 silicon germanium 24 ghz transmitter mmic spi final data sheet 23 revision 3.2, 2016-01-20 figure 3 timing diagram of the spi table 14 spi interface parameter symbol values unit test min. typ. max. spi_clk period t spi 50 ? ? ns spi_clk low time t sckl 0.45 t spi 0.5 t spi 0.55 t spi ns spi_clk high time t sckh 0.45 t spi 0.5 t spi 0.55 t spi ns chip select lead time t cs(lead) 20 ? ? ns time between falling edge of spi_clk and spi_do valid t sdov ??10ns setup time of spi_di before falling edge of spi_clk t sdis = t si(su) 10 ? ? ns hold time of spi_di after falling edge of spi_clk t si(h) 10 ? ? ns hold time of spi_do after rising edge of spi_clk t sdoh t sckh - 10ns ??ns hold time of spi_en af ter last falling edge of spi_clk t cs(lag) 30 ? ? ns delay between rising edge of spi_en and spi_do tristate (leakage current < 12 a) t sdotri ??100ns delay between falling edge of spi_en and msb at spi_do tristate valid t csdv ??125ns minimum time between two spi commands t min2spi 5?? s spi_en spi_clk t sckl t spi spi_di lsb msb t sdis t sdih t sckh t cs(lead) t cs(lag) spi_do lsb t sdotri t sdov msb 1) msb 2) t sdoh 1) msb from previous spi communication 2) msb from actual spi communication t csdv
BGT24AT2 silicon germanium 24 ghz transmitter mmic sensor multiplexer final data sheet 24 revision 3.2, 2016-01-20 attention: test means that the parameter is not subject to production test. it was verified by design / characterization. 5 sensor multiplexer output signals of the temperature and output level sensor s at tx1, tx2 and lo output are provided multiplexed at the output pin ana_out using an analog multiplexer (amux) circuit. additionally, a mmic internal reference voltage (vbg1) ca n be read out and an analog input signal within 1 v and 2 v can be directed from ana_in to ana_out. tristate capability is implemented in order to combine several analog outputs in the application. in this case it has to be ensured that only one multiplexer output is activated at any time. table 15 specification for spi pins parameter symbol values unit test min. typ. max. high-level input voltage v i_high 2.0??v low-level input voltage v i_low ??0.8v input voltage hysteresis v hys 50??mv input current i in -190 ? 150 a input capacitance (en, clk, di) cs in ??2pf spi_do output high voltage (vcc=3.3v, i sdo =1ma) v o_high 2.4??v spi_do output low voltage (vcc=3.3v, i sdo =1ma) v o_low ??0.8v spi_do load capacitance csl do ? ? 30 pf spi_do load resistance rsl do 10??k pull up resistor (spi_di) t a =25c rpl_spi_di 78 98 118 k pull up resistor (spi_clk, spi_en) t a =25c rpl_spi_clk, rpl_spi_en 19.6 24.5 29.4 k leakage current @ spi_do in high z state (test voltage 2.4 v) il do ??12 a table 16 truth table amux 1) 1) deviating states not allo wed, undefined amux output output at ana_out amux1_ sel1 amux1_ sel0 amux2_ sel2 amux2_ sel1 amux2_ sel0 tristate x x 0 0 0 ana_in x x 0 0 1 vtemp x x 0 1 1 psense_tx2 0 0 1 0 0 psense_tx1 0 1 1 0 0 psense_lo 1 x 1 0 0 vbg1 (bandgap output voltage) x x 1 0 1
BGT24AT2 silicon germanium 24 ghz transmitter mmic lo logic final data sheet 25 revision 3.2, 2016-01-20 6 lo logic the BGT24AT2 accommodates a logic circuit which can be used to either activate the lo-output manually or automatically depending on the tx1/tx2 configuration. three operation modes are selectable: 1. manual activation / deactivation of the lo output via external pulse pin lo_on 2. manual activation / deactivation of the lo output via spi bit lo_spi_on 3. automatic activation / deactivation depending on the tx1 / tx2 configuration. the configuration of the lo logi c operation mode is shown in table 17 . table 17 truth table lo logic lo_sel1 lo_sel0 function 0 0 lo activation via external pulse pin lo_on 0 1 lo activation via spi bit lo_spi_on 1 x automatic lo activation via external pulse pins tx1_on or tx2_on
BGT24AT2 silicon germanium 24 ghz transmitter mmic package dimensions final data sheet 26 revision 3.2, 2016-01-20 7 package dimensions figure 4 package outline (top, side and bottom view) of vqfn32-9 figure 5 marking layout vqfn32-9 figure 6 tape of vqfn32-9 c 0.08 32x a b 9 x 0.5 = 4.5 0.5 5 x 0.5 = 2.5 0.5 32x 0.05 m b a c pg-vqfn-32-9, -15-po v01 1) 17 10 11 16 26 index marking 1 27 32 5.3 index marking 1) vertical burr 0.03 max. all sides 5.5 0.1 4.5 4.3 0.1 0.1 0.03 0.9 max. (0.2) 0.05 max. +0.03 seating plane (0.65) 3.4 (2.9) 0.07 0.55 0.05 4.4 (3.9) 0.25 0.1 0.05 BGT24AT2_vqfn32-9_ml.vsd g-vqfn-32-9--tv 4.9 2 .9 .3 .3 dm
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